"

博乐博乐彩票平台-官网首页

  • "
    學術報告
    我的位置在: 博乐博乐彩票平台-官网首页 > 學術報告 > 正文
    Design Automation for 2.5D&3D Heterogeneous Integrated Circuits and Power Electronics(2.5D和3D異構集成電路和電力電子的設計自動化)
    瀏覽次數:日期:2020-01-03編輯:信科院 科研辦

    時間:2020.1.7(星期二)上午9:00

    地點:信科院624(原542)教室

    報告人彭亞銳,美國阿肯色大學計算機科學與工程系任助理教授

    主持人:蔣斌

    內容簡介:

    Abstract: As a leading contender of more-than-Moore technology, 2.5D/3D integrated circuits are built by stacking and connecting multiple chiplets with high-density inter-die vias. Heterogeneous integrated packaging is another promising solution to balance the performance, power, and cost tradeoff in processors, GPUs, FPGAs, and neural network accelerators. Such aggressive integration leads to many-fold improvements in interconnection length and design footprint. The industry is now working relentlessly to build advanced multi-chiplet packages that satisfy the ever-demanding memory bandwidth and energy efficiency requirements in datacenter servers, self-driving automobiles, and low-power mobile devices. However, the high-power devices packed under a small footprint raise various reliability concerns including power delivery, heat dissipation, and noise coupling. Advanced Computer-Aided Design (CAD) tools, algorithms, and models are essential to carefully analyze and efficiently address these challenging and complicated problems.

    Another field that requires high-density and high-efficiency integration is power electronics. As a critical part of any electrical systems, power electronics design requires extensive knowledge of the device, circuit, package all the way to system and manufacturing. Designers need to understand electrical and thermal properties of materials, multi-physics design procedures, system control and optimization methodology, and the engineering art of design for manufacturability and reliability. Our research at the University of Arkansas targets both electrical and thermal issues altogether before an MCPM layout is finalized. A computer-aided design tool called PowerSynth is developed to further enrich the layout synthesis capability by introducing new algorithms and novel optimization methods for MCPM parasitic extraction, thermal modeling, heterogeneous integration, and reliability enhancement.

    In this talk, I will present CAD and design techniques to enhance electro-power-thermal reliability of 2.5D and 3D ICs. First, I will introduce a CAD platform that evaluates and optimizes power and thermal reliability for 3D memory cubes and 3D multi-core processors. Next, I will present various methodologies for extracting and optimizing new parasitic elements in face-to-back and face-to-face 3D ICs as well as 2.5D wafer-level packages. I will conclude with our collaborative research with the NSF POETS center at the University of Arkansas on design automation for multi-chip power electronics. Our PowerSynth design automation platform integrates new modeling methods, heterogeneous components, 3D layouts, and pushes power electronics designs further toward high-power-density electronics systems enabling unprecedented productivity

    報告人簡介:

    彭亞銳,1990年生,博士,現在美國阿肯色大學計算機科學與工程系任助理教授。2012年清華大學微電子所獲學士學位博乐博乐彩票平台-官网首页,2014年和2016年自美國佐治亞理工大學電子與計算機工程系分獲碩士和博士學位博乐博乐彩票平台-官网首页。主要研究方向為三維集成電路和碳化硅電力電路的計算機輔助設計自動化。博士階段的工作主要在3D集成電路領域,系統性地提出了全套信號和電源完整性解決方案博乐博乐彩票平台-官网首页。針對堆疊異質結構和硅穿孔陣列提出物理模型算法博乐博乐彩票平台-官网首页博乐博乐彩票平台-官网首页,并對硅過孔和導線采用模式匹配算法,結合版圖設計優化流程,設計實現了相應的噪聲提取與版圖優化工具,提升系統性能和信號完整性。針對雙層鍵合結構,提出了耦合層提取算法,解決了多廠商知識產權保護問題,同時提高了提取精度。針對2.5D晶圓級封裝博乐博乐彩票平台-官网首页博乐博乐彩票平台-官网首页,提出了基于環路電感的芯片封裝共同提取算法,并實現了混合封裝提取和版圖優化工具。同時博乐博乐彩票平台-官网首页,針對堆疊存儲器的電源完整性分析,提出了電源模型和系統性能統一分析工具。2017年入職阿肯色大學后,在電力電子領域實現了業界第一套功率模塊電氣和熱穩定性版圖優化工具。創造性地引入圖算法和電路模型,實現了版圖自動生成,自動優化博乐博乐彩票平台-官网首页,自動提取寄生參數和可靠性分析等功能。工作發表在頂級會議和刊物上并在SRC博乐博乐彩票平台-官网首页,ICPT和EPEPS等會議上獲過最佳論文獎。

    Yarui Peng received the B.S. degree from Tsinghua University, Beijing, China in 2012. He earned his M.S. degree and Ph.D. in School of Electrical and Computer Engineering from Georgia Institute of Technology, Atlanta, USA in 2014 and 2016, respectively. He joined the Department of Computer Science and Computer Engineering at the University of Arkansas as an assistant professor in Jan. 2017. He also works with the NSF sponsored Engineering Research Center for Power Optimization of Electro-Thermal Systems (POETS-erc.org).

    His research interests are in the areas of computer-aided design, analysis, and optimization for emerging technologies and systems, such as 2.5D and 3D ICs, high band-gap power electronics and systems, and high-efficiency digital designs and memory systems. He developed methodologies and algorithms for parasitic extraction, analysis and optimization for signal integrity, and alleviating reliability issues in thermal and power delivery in 2.5D and 3D ICs. He is also working on improving electro-thermal reliability in power systems such as multi-chip power modules (MCPMs). He is the recipient of best-in-session award in SRC TECHCON 14 and best student paper award in ICPT 16.

    "博乐博乐彩票平台-官网首页
  • "